A full turnkey solution with comprehensive features from wafer input, electrical/ functional test, 6 sided vision inspection, sorting and tape & reel specifically designed for MES microphone. It is also capable of performing component level traceability by reading the 2DBC on the microphones.
Input Options | 8”, 10”, 12” Wafer, De-Taper |
Output Options | Tape & Reel, JEDEC Tray |
Package Type | MEMS Microphones |
Sprint UPH | >20,000 (depending on packages & machine configuration) |
Vision Capabilities | Top Inspection, 2D Pad Measurement, 3D Measurement, Active Die Inspection, In-Pocket Inspection, Post Seal Inspection |
Test Capabilities | Sensitivity Test, Signal To Noise Ratio (SNR) Test |
Individual Press (IP) Force Control |
Up to 10N independent Z axis Up to 50N independent Z axis (optional) Up to 80N with Pneumatic Solution (optional) |