Gideon

GIDEON

Our GIDEON series comprise of a single tray to tray handler which is dock-able onto either a single test cell or up to 3 test cells which helps to improve flexibility and reusability. They are highly customizable and configurable for various kinds of test methodologies, capable to cater a wide range of smart sensors such as Structured Light 3D Sensors, Proximity Sensors, Time of Flight 3D Sensors, Ambient Light Sensors and many more.

GIDEON’s Configurations/Specifications

Input Options JEDEC Tray
Output Options JEDEC Tray, Tape & Reel
UPH Ranging from 600 to 1200 (Depending on package & machine configuration)
Test Site Up to 6 or 12 sites
Test Capabilities Light Current Voltage (LIV) Sweep Test, Far Field Test
Vision Capabilities 2D Matrix Inspection, DUT Position & Orientation, System Alignment, 6-Sided AOI (Optional)
Intelligent Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling, Automated Site/Nest Disabled, Automated Pogo Pins Cleaning, Lens Shading Correction, Distortion Correction, Light Calibration

Input Options JEDEC Tray
Output Options JEDEC Tray
UPH Up to 3200 (Depending on package & machine configuration)
Test Site Up to 24 test sites
Test Capabilities Light Current Voltage (LIV) Sweep Test, Angular & Module Reflectance Test, PD Test, Cross Talk Test
Vision Capabilities 2DBC Inspection, Dimension Measurement
Intelligent Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring

Input Options JEDEC Tray
Output Options JEDEC Tray, Tape & Reel
UPH Up to 1200 (Depending on package & machine configuration)
Test Site Up to 12 sites
Test Capabilities Light Current Voltage (LIV) Sweep Test, Far Field Test, Tri-Temperature Test (-40°C to +150°C) [Optional]
Vision Capabilities 2D Matrix Inspection
Intelligent Features Automated GR&R, Automated Golden Unit Monitoring, Automated Retest, Automated Yield Monitoring, Automated OQC Sampling Test

Input Options JEDEC Tray
Output Options JEDEC Tray
UPH Up to 2250 (Depending on package & machine configuration)
Test Site Multiple Test Cells Up to 108 Parallel test sites
Test Capabilities Electrical Functional Test, Optical Alignment Test, Sensitivity Test, Light Leakage Test, Sensor Calibration, Post Sensor Calibration Test, Sensor Spectral Test, LED Angular Test
Vision Capabilities Present/ Absent Inspection, Positioning Verification
Intelligent Features Automated Golden Unit Monitoring, Spectrometer Audit Control, Automated GR&R, Automated Retest, Run Time Log, Automated Low Yield Monitoring, UPH Tracker, Test Socket Disable

Input Options Customized Tray
Output Options Customized Tray
UPH >500 (Depending on package & machine configuration)
Test Site Up to 14 sites
Test Capabilities Electrical Test, Functional Test, Image Test
Vision Capabilities X, Y, Rotation & Z Alignment
Intelligent Features Programmable Light Source Color Temperature, Auto X, Y Rotation & Z Alignment, Automated Retest, Automated GR&R

Input Options JEDEC Tray
Output Options JEDEC Tray
UPH >500 (Depending on package & machine configuration)
Test Site Up to 70 sites
Test Capabilities Electrical Test, Wavelength + Calibration Ratio Error + Modular Sensitivity Test, Optical Power & Spectrum Test, Functional Test, LED Field of Illumination
Vision Capabilities
Intelligent Features Automated GR&R, Automated Retest, Automated Yield Monitoring, Tray Mapping Integration

Package Micro LED
UPH >1,200 (Depending on package & machine configuration)
Input Options REL Board, JEDEC Tray
Output Options REL Board, JEDEC Tray
Reject Options REL Board
Vision Capabilities
  • 2DBC Scanning
  • DUT Alignment
Vision Accuracy (depending on package type)
Test Capabilities
  • Colorimeter Image Test (Luminance, Radiance, Illuminance, Irradiance, Luminous Intensity, Radiant Intensity, CIE Chromaticity Coordinates, Color Scale, Correlated Color Temperature (CCT), Dominant Wavelength, Uniformity, Dead Pixel, Crosstalk)
  • Electrical Functional Test (VF Scan, Pixel Current, Current Consumption, Bias Voltage, Temperature Measurement, I2C & SPI Communication)
Test Sites
Test Contact Method Punch Type
Test Socket Options Kelvin/Non-Kelvin
Machine Features