PM1100 is a Single Track Gravity Feed Test & Vision handler that provides easy handling of tube-to-tube and Tape & Reel output. Highly recommended for larger semiconductor packages, this system offers high-speed and accurate inspection of lead, mark and package defects.
Benefits
- Low cost of ownership
- Easy maintenance
- High accuracy& reliability
- Long term stability
Features
- High speed up to 8,000 UPH
- Low-cost Vision and Test handler
- Configurable and scalable to different input and output media
- 3D comprehensive inspection, from lead, mark and package inspection
- Small footprint
- Able to process a wide spectrum of packages
- Scalability / Future Enhancement: Multiple test sites
Product Specifications
Packages Plastic molded / Ceramic TSSOP, SSOP, QSOP, SOIC POWER, PDIP, SOJ
Machine
Dimension (LxWxH) 1960 x 850 x 1320mm
Power 208 or 230 VAC 50/60 Hz Single phase
Air 70 psi
Power consumption 20 Amps
Machine controller PC based (Pentium based, SVGA monitor, Keyboard & Track ball)
Input Options Tube
Output Options Tube, Tape & Reel
Machine Performance
MTBA >1 hour based on lot size
MTBF >200 hours
MTTR <20 minutes
MTTA <30 seconds
Vision Inspection Capabilities
Vision Repeatability Accuracy 0.3 mil
GR&R < 10 %
Lead Inspection Quantity, Length, Width, Spacing, Tweeze / Implied Coplan, Slant, Spread, Whisker (>5 mil length), Bridging (>5 mil length), Standoff, Co-planarity, Bent in / out
Mark Inspection Missing, Llegible, Incomplete, Incorrect, Mis-Aligned, Double, Angle, Reverse, No mark, Bow, Extra ink, Smeared/Blurred, Scratch/Broken, 2D Matrix code
Package Inspection Incomplete mold, orientation (Notch), *Contamination, *Chipping, *Void,
*Must >10 mil area depending on image resolution, inspection criteria and capability. Subjected to package type, size, color and material.
Package Inspection
(leadless package)Incomplete mold, orientation (Notch), *Contamination, *Chipping, *Void, Unit dimension, Pad, Mold Flash, Saw offset
*Must >10 mil area depending on image resolution, inspection criteria and capability. Subjected to package type, size, color and material.
Others In-pocket non sealed inspection
Machine Performance MTBA >1 hour based on lot size
MTBF >200 hours
MTTR <20 minutes
MTTA <30 seconds
Test Specifications Contact Finger Kelvin or non-Kelvin contact finger
(10 micron inch Full hard gold plating)
Contact Resistance > 50 milliohm Ohm max at 100 milli ampere
Durability 1M insertions at 50gm
Tape & Reel Specifications Heat Seal 0.5 - 0.7mm Heat Seal Lip Width
Seal Temperature User defined
Seal Time (Dwell) User defined
Seal Pressure Cam system
Carrier Tape Drive Method Micro Stepping Motor
Conversion time 30 to 60 minutes (for entire package type change)
5 minutes for same package size
